JPH079381Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH079381Y2
JPH079381Y2 JP1990109418U JP10941890U JPH079381Y2 JP H079381 Y2 JPH079381 Y2 JP H079381Y2 JP 1990109418 U JP1990109418 U JP 1990109418U JP 10941890 U JP10941890 U JP 10941890U JP H079381 Y2 JPH079381 Y2 JP H079381Y2
Authority
JP
Japan
Prior art keywords
resin case
adhesive
groove
heat dissipation
horizontal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990109418U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0465451U (en]
Inventor
行良 中村
健司 上田
頼秀 土岐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sansha Electric Manufacturing Co Ltd
Original Assignee
Sansha Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sansha Electric Manufacturing Co Ltd filed Critical Sansha Electric Manufacturing Co Ltd
Priority to JP1990109418U priority Critical patent/JPH079381Y2/ja
Publication of JPH0465451U publication Critical patent/JPH0465451U/ja
Application granted granted Critical
Publication of JPH079381Y2 publication Critical patent/JPH079381Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
JP1990109418U 1990-10-18 1990-10-18 半導体装置 Expired - Fee Related JPH079381Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990109418U JPH079381Y2 (ja) 1990-10-18 1990-10-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990109418U JPH079381Y2 (ja) 1990-10-18 1990-10-18 半導体装置

Publications (2)

Publication Number Publication Date
JPH0465451U JPH0465451U (en]) 1992-06-08
JPH079381Y2 true JPH079381Y2 (ja) 1995-03-06

Family

ID=31856619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990109418U Expired - Fee Related JPH079381Y2 (ja) 1990-10-18 1990-10-18 半導体装置

Country Status (1)

Country Link
JP (1) JPH079381Y2 (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310381A (ja) * 2005-04-26 2006-11-09 Toyota Industries Corp 電子機器
JP5310660B2 (ja) * 2010-07-01 2013-10-09 富士電機株式会社 半導体装置
JP6766744B2 (ja) * 2017-05-10 2020-10-14 株式会社豊田自動織機 半導体モジュール

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55126649U (en]) * 1979-03-01 1980-09-08
JPS58166045U (ja) * 1982-04-28 1983-11-05 日本電気株式会社 半導体装置
JPS62108545A (ja) * 1985-11-06 1987-05-19 Shinko Electric Ind Co Ltd プリント基板型パッケ−ジ

Also Published As

Publication number Publication date
JPH0465451U (en]) 1992-06-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees